0.8mm Aluminum Based Copper Clad Laminate CCL Cu18 1.0W/m.K 1*1.2M Sheet For LED PCB Board Insulated Metal Substrates

0.8mm Aluminum Based Copper Clad Laminate CCL Cu18 1.0W/m.K 1*1.2M Sheet For LED PCB Board Insulated Metal Substrates

Product Item : ACL0815R10-BF
Category： Aluminum Based CCL
Thickness (mm) : 08 mm
Copper Foil Thickness (um) : 15/18/25/35 um
TC-W/(m·K) : 1W/(m·K)
Sheet Size(mm) : 1200*1000 mm
Product description：0.8mm Thickness Aluminum Based Copper Clad Laminate Sheet (CCL) Copper foil thickness 15/18/25/35 Optional Thermal conductivity coefficient 1W/(m·K) Sheet Size 1200*1000 mm For LED PCB Board
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Product Introduction

Aluminum based copper clad laminate used for PCB (Printed Circuit Board) electronic material, mainly used in electronic devices that require efficient heat dissipation. It is composed of aluminum plate, high thermal conductivity insulation layer, and copper foil.

Aluminum based copper clad panels are mainly used in LED lighting, chemical, automotive, mechanical manufacturing, shipbuilding, and aviation fields, which have high requirements for material heat dissipation performance and mechanical strength.

The aluminum based copper clad plate produced by Chaowei has various characteristics, including:

1. Good thermal conductivity, low thermal resistance, and fast heat dissipation

2. High hardness, strong corrosion resistance, high mechanical strength, and not easily deformed

3. Shielding performance, blocking electrical interference, and protecting the normal operation of sensitive components in the circuit

Product Parameters

Product Code	ACL0815R10-BF
Product Brand	CHAO WEI
Certification Type	SGS
Product Name	Aluminum based copper clad laminate
Product Size (mm)	1000*1200
Insulation layer material	Resin
Total thickness (mm)	0.8mm
physical total thickness (mm)	0.72mm
Copper foil thickness (um) Optional	15/18/25/35 um
Thermal conductivity coefficient W/(m·K)	1W/(m·K)
With or Y/N Blue Film	Y

Product Test Report

Test Item	Testing Basis	Test Value
Peel Strength	GJB 1651-1993 / SJ 20780-2000	AVG 1.04 N/mm
Surface Resistivity	GJB 1651-1993 / SJ 20780-2000	Min:3.2E+08（MΩ）
Volume Resistivity	GJB 1651-1993 / SJ 20780-2000	Min:5.5E+06（MΩꞏm）
Breakdown Voltage	GJB 1651-1993 / SJ 20780-2000	Min:4.9 kV
Thermal Shock	GB/T 4722-1992 / SJ 20780-2000	No layering or bubbling phenomenon occurred
Thermal Conductivity Coefficient	ASTM D 5470-17	0.81 W/（m.K）
Thermal Resistance（Kꞏc㎡/W）	ASTM D 5470-17	1.34 K.c㎡/W
Dielectric Constant & Dielectric Loss Factor (1 MHz)	GJB 1651-1993 / SJ 20780-2000	3.9C²/(N·M²)
Glass Transition Temperature & Curing Factor	IPC-TM-650	2.23Tg（℃）

Application Area

Main applications:

1. LED lighting

2. Communication equipment

3. Aerospace field

4. Automotive electronic modules

Factory advantages

1. Production experience: Chaowei Co., Ltd. has over 10 years of production experience since its establishment.

2. Quality System: The product has a complete quality process management system from raw materials to aluminum based copper clad plates, including pressure resistance testing, oxidation resistance testing, heating testing, density and impurity testing, energy testing, and other systems.

3. Collaboration experience: Collaborated with many large and small and medium-sized enterprises, including TCL, FCL, BULL, HUAYI, Midea, MUSENLIN, NVC and other companies and brands.